Engineer II - Failure Analysis

About the role

Microchip Technology is seeking an Engineer II to perform detailed electrical and physical failure analysis on its semiconductor products. The role involves using a range of non‑destructive and destructive analytical tools to identify root causes and provide clear reports to internal teams and customers.

Key responsibilities

• Conduct electrical and physical failure analysis using X‑ray, Scanning Acoustic Microscopy (SAM), optical microscopy, and bench verification tools.
• Interpret ATE data, circuit schematics, and apply fault isolation techniques such as Photo Emission Microscopy (PEM), thermal hotspot analysis, and OBIRCH.
• Perform delayering and decapsulation using chemical, laser, and mechanical methods, followed by SEM/EDX analysis.
• Collaborate with cross‑functional teams including Quality, Reliability, Design, Test, and Wafer Fab to resolve failure cases.
• Prepare and deliver comprehensive failure analysis reports and updates to customers.

Required profile

• Engineering background with experience in semiconductor failure analysis.
• Strong analytical skills and ability to work with cross‑functional teams.
• Excellent written communication for reporting findings.

Required skills

• X‑ray inspection
• Scanning Acoustic Microscopy (SAM)
• Optical microscopy
• Electrical bench verification
• Automated Test Equipment (ATE) data analysis
• Circuit schematic interpretation
• Photo Emission Microscopy (PEM)
• Thermal emission/hotspot analysis
• Optical Beam‑Induced Resistance Change (OBIRCH)
• Die‑level microprobing
• Chemical and laser decapsulation
• Chemical etching, dry etching, mechanical polishing
• Scanning Electron Microscopy (SEM)
• Energy Dispersive X‑ray spectroscopy (EDX)

What we offer

• Opportunity to work on cutting‑edge semiconductor technology.
• Access to advanced analytical equipment and cross‑functional collaboration.
• Career development programs within a global, multi‑billion‑dollar organization.