Staff Process Engineer – Die Attach & Clip Attach

About the role

The Staff Process Engineer for Die Attach and Clip Attach leads the development, optimization, and sustainment of solder die‑attach and clip‑attach processes. You will ensure stable yields, high equipment uptime, and full compliance with reliability and customer requirements across both new‑product introductions and high‑volume manufacturing.

Key responsibilities

• Define, sustain, and optimize die‑attach parameters, tooling, and recipe management systems.
• Maintain process capability (Cp/Cpk), process performance (Ppk), PFMEA, Control Plans, Work Instructions, and One‑Point Lessons.
• Lead yield and quality improvement initiatives using 8‑D, DMAIC, and root‑cause tools such as 5‑Whys and Ishikawa.
• Conduct DOE studies, parameter‑window validation, and material/tooling improvements to reduce ppm loss and scrap.
• Qualify solder paste, flux, substrates, lead‑frames, and plating finishes; set incoming and line qualification criteria.
• Prepare documentation for customer, IATF/ISO, and internal audits and manage change control.
• Collaborate with Production, Equipment, Quality, NPI, Planning, and SQE teams to meet OEE, quality, and delivery goals.

Required profile

• Bachelor’s degree in Engineering (Industrial, Mechanical, Electronics, Chemical or related).
• 10+ years of semiconductor manufacturing experience, with at least 8 years focused on solder die‑attach/clip‑attach for module packages.
• Hands‑on experience with die bonders and reflow platforms (e.g., ASM, ESEC) and high‑mix, high‑reliability products.
• Proven track record in capability studies, DOE, and continuous‑improvement projects.

Required skills

• Solder metallurgy, wetting, void mechanisms, thermal management, surface finishes (ENIG, ENEPIG, Ag, Pd).
• Statistical Process Control (SPC), Measurement System Analysis (MSA/GR&R), PFMEA, Control Plans.
• Data analysis tools: Minitab, Exensio, Excel.
• Design of Experiments (DOE) and capability analysis (Cp/Cpk, Ppk).

What we offer

• Opportunity to work on cutting‑edge automotive and industrial semiconductor technologies.
• Collaborative, high‑performance engineering environment.