Production Operator (Probe and Die Sales)

About the role

Join a leading semiconductor company to advance high‑precision production by applying technical skills in back‑end assembly test operations. This role supports the manufacturing of semiconductor devices and contributes to the company’s innovative product portfolio.

Key responsibilities

• Perform specific back‑end semiconductor manufacturing functions in the production of semiconductor devices.
• Operate equipment for wafer scribe and break, die sort, die attach, lead bonding and seal, test, and mark and pack.

Required profile

• Graduate of a 2‑year technical course, senior high school graduate, or at least two years of college education.

Required skills

• Wafer scribe and break
• Die sort
• Die attach
• Lead bonding and seal
• Test
• Mark and pack