Failure Analysis Engineer

About the role

The Failure Analysis Engineer will lead comprehensive failure investigations on returned semiconductor devices, identifying root‑cause mechanisms for both internal and external customers. This role supports product reliability and drives continuous improvement across the portfolio.

Key responsibilities

• Interpret semiconductor device specifications and schematics at the transistor level.
• Utilize bench test equipment to verify failure modes.
• Apply failure isolation techniques such as Emission Microscopy and OBIRCH.
• Perform chemical decapsulation using acids and bases.
• Conduct mechanical micro‑probing at the die level for nodal analysis.
• Generate detailed failure analysis reports for internal and external stakeholders.
• Interact with customers and cross‑functional teams as needed.

Required profile

• Bachelor’s degree in Electrical/Electronic Engineering, Computer Engineering, Semiconductor Physics, or a related field.
• Experience in failure analysis, product analysis, or related engineering roles is preferred.
• Strong communication and interpersonal skills for report writing and customer interaction.
• Ability to work independently or within a team with minimal supervision.

Required skills

• Emission Microscopy
• OBIRCH failure isolation
• Chemical decapsulation procedures
• Mechanical micro‑probing at die level
• Device schematic analysis
• Understanding of semiconductor physics and transistor behavior
• Knowledge of semiconductor failure mechanisms
• Familiarity with Image Sensor devices (advantage)

What we offer

• Opportunity to work on cutting‑edge semiconductor technologies.
• Collaborative environment with global customers.
• Access to advanced failure analysis tools and resources.