Production Operator

About the role

We are seeking Production Operators to contribute to high‑precision semiconductor production by applying technical skills in back‑end assembly test operations. The role supports the manufacturing of semiconductor devices that power automotive, industrial and other advanced markets.

Key responsibilities

• Operate equipment for wafer scribe and break.
• Perform die sort and die attach processes.
• Execute lead bonding and sealing operations.
• Conduct testing of semiconductor devices.
• Mark and pack finished products for shipment.

Required profile

• Graduate of a 2‑year technical course, senior high school, or at least two years of college education.

Required skills

• Operation of wafer scribe equipment.
• Die sort and die attach handling.
• Lead bonding and sealing techniques.
• Semiconductor test equipment usage.