Package Architect – Semiconductor Power Packaging

About the role

Nexperia is seeking a highly driven Package Architect to lead the development and qualification of new power‑package solutions. You will work closely with internal teams, subcontractors, and business groups to deliver robust package and process technologies that meet customer and strategic requirements.

Key responsibilities

• Develop and qualify new package, process, and technology solutions for power‑package applications.
• Collaborate with internal sites, subcontractors, and cross‑functional teams to support business strategy execution.
• Conduct package and process integration assessments during development.
• Prepare technical reports, papers, and invention disclosures.
• Lead subcontractor selection, RFQ evaluation, risk assessment, and capability reviews.
• Validate Design of Experiments (DOE), oversee evaluations, and manage process freezes.
• Drive failure‑analysis investigations and mitigation plans for reliability issues.
• Maintain regular communication with stakeholders on technical gaps and project progress.

Required profile

• Broad knowledge of semiconductor assembly processes, including pre‑assembly, die attach, clip attach, wire bond, molding, trim & form, and singulation.
• Experience with engineering and quality tools such as SPC, DOE, MSA/GRR, 8D, and root‑cause analysis.
• Strong technical competence in risk assessment, failure analysis, and subcontractor management.
• Ability to produce clear technical documentation and presentations.

Required skills

• Pre‑Assembly
• Die Attach
• Clip Attach
• Wire Bond
• Molding
• Trim and Form
• Singulation
• Statistical Process Control (SPC)
• Design of Experiments (DOE)
• Measurement System Analysis / Gage R&R (MSA/GRR)
• 8‑D problem‑solving
• Root‑Cause Analysis
• Failure Analysis
• Risk Assessment
• Package Design and Qualification