Mold Equipment Engineer – Semiconductor Manufacturing

About the role

Texas Instruments is seeking a Mold Equipment Engineer to support its semiconductor manufacturing operations. The role involves ensuring equipment quality, reliability, and uptime across mold processing lines.

Key responsibilities

• Ensure quality and integrity in executing mold equipment engineering processes.
• Oversee installation, modification, upgrade, and maintenance of manufacturing equipment.
• Stay current with equipment manufacturers’ technical notices, upgrades, and safety issues.
• Study equipment performance and reliability to develop improvement programs.
• Provide technical support to manufacturing equipment repair and process engineering teams.
• Define and write preventative maintenance schedules.

Required profile

• Bachelor’s degree in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science, Physics or related field.
• Minimum 5 years of experience as an Equipment Engineer in a semiconductor manufacturing environment.

Required skills

• Hands‑on experience with Mold Asahi or Towa machines.
• Advanced mold die tooling disassembly and assembly.
• Tooling design and modification expertise.
• Equipment setup, maintenance and troubleshooting.
• Basic machine calibration knowledge, including use of handy panels and calibration jigs.
• Understanding of equipment and process parameters and material‑to‑machine integration.
• Familiarity with Nordson or Panasonic plasma bake ovens, CSAM/X‑ray equipment (nice to have).

What we offer

• Competitive compensation and comprehensive benefits.
• Opportunities for career growth and development within a global semiconductor leader.
• Inclusive culture that values diverse perspectives.