Wire Bond Operator – Semiconductor Production
onsemi · Lapu-Lapu
Description du poste
About the role
We are looking for a Wire Bond Operator to work on our semiconductor production line. The role focuses on operating equipment and supporting the line to achieve high throughput, quality, and yield while adhering to safety and quality standards.
Key responsibilities
- Operate wire‑bond and related production equipment according to specifications and work instructions.
- Follow and enforce semiconductor manufacturing requirements such as ESD control, 5S, and clean‑room standards.
- Report any problems promptly to production technicians and supervisors.
- Comply with IATF16949 and EHS guidelines and complete required documentation.
- Support the production line coordinator in meeting production targets.
- Handle raw and auxiliary materials and tools correctly to ensure efficient, cost‑effective manufacturing.
- Participate in TPM activities and continuous‑improvement initiatives.
- Complete work sheets and perform any temporary tasks assigned by supervisors.
Required profile
- Graduate of a 2‑year technical program, senior high school, or at least two years of college education.
- Preferably experienced in semiconductor manufacturing and shift work.
Required skills
- ESD handling
- 5S methodology
- IATF16949 compliance
- EHS compliance
- TPM (Total Productive Maintenance)
- Operation of semiconductor production equipment
What we offer
- Opportunity to work in a leading semiconductor company focused on automotive and industrial markets.
- Access to training and development programs.
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onsemi
Lapu-Lapu
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