Semiconductor Operator – Clip Bond/Wire Bond

About the role

We are looking for a Semiconductor Operator to support high‑precision back‑end assembly and test operations. The role contributes to the production of advanced semiconductor devices by operating specialized equipment.

Key responsibilities

• Perform back‑end manufacturing functions for semiconductor devices.
• Operate equipment for wafer scribing and breaking, die sorting, die attach, lead bonding and sealing.
• Conduct testing, marking and packing of finished parts.

Required profile

• Graduate of a 2‑year technical program, senior high school graduate, or at least two years of college education.

Required skills

• Back‑end assembly test operation.
• Wafer scribe and break.
• Die sort.
• Die attach.
• Lead bonding and seal.
• Test, marking and packing of semiconductor devices.

What we offer

• Opportunity to work with cutting‑edge semiconductor technology.
• Career development within a global leader in power and sensing solutions.