Operator – Die Bond Production

About the role

The Operator (Die Bond) is responsible for running production equipment and supporting the manufacturing line to achieve high throughput, quality, yield and optimal cycle time in a semiconductor environment.

Key responsibilities

• Follow semiconductor manufacturing standards such as ESD, 5S, and cleanroom protocols, reporting any issues promptly.
• Operate equipment or perform assigned tasks according to specifications and work instructions.
• Comply with IATF16949 and EHS requirements as defined in the manuals.
• Support the production line coordinator in meeting all production goals.
• Handle raw, auxiliary materials and tools correctly to ensure efficient, cost‑effective manufacturing.
• Participate in TPM and continuous‑improvement activities on the line.
• Complete work sheets accurately to document results.
• Perform any temporary tasks assigned by the supervisor.

Required profile

• Graduate of a 2‑year technical program, senior high school, or at least two years of college education.
• Experience in semiconductor manufacturing is preferred.
• Experience working shifts is preferred.

Required skills

• Semiconductor manufacturing processes
• Equipment operation
• Understanding of ESD, 5S, cleanroom standards
• Knowledge of IATF16949 and EHS compliance
• TPM (Total Productive Maintenance) practices

What we offer

• Opportunity to work with a leading company in power and sensing technologies.
• Exposure to automotive, industrial, and renewable‑energy markets.
• Career development within a global, innovative organization.