NPI Die Attach Process Technician

About the role

The NPI Die Attach Process Technician supports the development and validation of new process bricks for die‑attach operations, ensuring robust settings, material and equipment capability for successful product release to mass production.

Key responsibilities

• Set up and operate die‑attach machines (epoxy or solder), load materials, configure recipes and create new process bricks for various package types.
• Monitor process performance, resolve major issues using available tools and methodologies in coordination with the local team.
• Ensure proactive quality compliance, analyse root causes of problems, recommend and evaluate corrective actions.
• Troubleshoot machine errors, implement corrective actions to reduce scrap.
• Support statistical analysis and DOE activities together with the Die Attach Engineer.

Required profile

• Bachelor's degree in electronics, mechanical engineering or a related field.
• Minimum 2 years experience in die‑attach processes within semiconductor manufacturing.
• Proficiency with Microsoft Office.
• Willingness to work rotating shifts.

Required skills

• Familiarity with pick‑and‑place systems, dispensing mechanisms and microscopic inspection.
• Knowledge of equipment such as ESEC 2100, ASM 8912, ASM 838, Datacon and stencil printing tools.