Serial Life Management (SLM) Engineer – SMT Process Optimization

About the role

The Serial Life Management (SLM) Engineer will lead the development, implementation and continuous improvement of Surface Mount Technology (SMT) manufacturing processes. You will work in a high‑volume electronics environment to drive quality, productivity and cost targets while supporting new product introductions.

Key responsibilities

• Develop and optimise SMT process parameters such as solder paste printing, SPI, pick‑and‑place, reflow soldering and AOI inspection.
• Monitor and improve Overall Equipment Effectiveness (OEE), First Pass Yield (FPY), process capability and line throughput.
• Conduct process validation, machine qualification and line readiness activities for new products.
• Provide technical support and troubleshooting for SMT production lines and automated equipment.
• Maintain and optimise equipment including Fuji pick‑and‑place machines, Koh Young SPI systems, Viscom AOI systems, reflow ovens and solder‑paste printers.
• Collaborate with Maintenance to enhance equipment reliability and preventive‑maintenance effectiveness.

Required profile

• 3‑5 years of hands‑on experience in high‑volume SMT manufacturing, preferably in automotive, industrial or high‑reliability electronics.
• Proven track record in process optimisation, yield improvement and defect reduction.
• Strong knowledge of quality and problem‑solving methodologies (8D, 7 QC Tools, CAPA, FMEA, SPC, RCA).
• Experience with new‑product launch, line setup, process documentation and cross‑functional teamwork.
• Familiarity with lean manufacturing, continuous improvement and cost‑reduction initiatives.

Required skills

• Fuji pick‑and‑place machines
• Koh Young SPI systems
• Viscom AOI systems
• Reflow ovens and solder‑paste printers
• SMT process optimisation (paste printing, SPI, placement, reflow, inspection)
• OEE and FPY analysis
• 8D problem‑solving, FMEA, SPC, RCA