Plating Process Engineer – Semiconductor Manufacturing

About the role

We are seeking an experienced and highly motivated Process Engineer to lead and support our plating and backetch processes. In this role you will own the processes, drive capability improvement, troubleshoot technical issues and coordinate across functions to ensure safe, efficient and high‑quality manufacturing operations.

Key responsibilities

• Own and optimise plating, water‑jet and backetch processes to meet safety, quality, delivery and cost targets.
• Lead troubleshooting and root‑cause analysis for yield loss, process excursions, defects and equipment‑related issues.
• Define, review and improve process recipes, operating windows and control plans.
• Analyse process data, identify trends and implement corrective and preventive actions.
• Drive continuous‑improvement initiatives to reduce defects, cycle time, chemical consumption and operational cost.
• Support process qualification, validation and change management for new materials, equipment and product introductions.
• Collaborate with Production, Quality, Maintenance, Equipment Engineering and EHS teams to resolve issues and implement improvements.
• Ensure compliance with company standards, environmental regulations and safety requirements.
• Develop and maintain process documentation, specifications, work instructions and technical reports.
• Provide technical leadership and mentorship to junior engineers and technicians.

Required profile

• Bachelor’s degree or higher in Chemical Engineering, Chemistry or a related field.
• Strong experience in process engineering within manufacturing, preferably in tin plating, wet chemical, etching or similar high‑precision processes.
• Proven ability to troubleshoot complex process issues and lead structured root‑cause analysis.
• Strong understanding of process control, statistical analysis and process capability improvement.
• Excellent communication, coordination and documentation skills.
• Ability to work effectively across multiple functions and manage technical priorities.

Required skills

• Tin plating
• Wet chemical processes
• Etching
• Process control
• Statistical analysis
• Process capability improvement
• Data analysis tools
• Microsoft Excel
• SPC, DOE, FMEA, 8D, 5 Why methodologies