Operator – Mold, Package Saw, Trim & Form

About the role

The Operator will run mold, package saw, trim and form equipment on a semiconductor production line. The focus is on maximizing throughput while maintaining high quality, yield and optimal cycle times in a fast‑paced manufacturing environment.

Key responsibilities

• Follow semiconductor manufacturing requirements such as ESD, 5S, and cleanroom standards, reporting any issues promptly.
• Operate assigned equipment according to specifications and work instructions, ensuring correct and safe execution.
• Adhere to IATF16949 and EHS guidelines as defined in the company manuals.
• Support the production line coordinator in meeting all production targets.
• Identify, handle, and correctly use raw materials, auxiliary tools, and consumables to promote efficiency and cost‑effectiveness.
• Participate in TPM activities and other continuous‑improvement initiatives.
• Complete required worksheets and documentation accurately.
• Perform any additional temporary tasks assigned by the supervisor.

Required profile

• Graduate of a 2‑year technical program, senior high school, or at least two years of college education.
• Prior experience in semiconductor manufacturing is preferred.
• Experience working rotating or shift schedules is an advantage.

Required skills

• ESD handling
• 5S methodology
• IATF16949 compliance
• TPM (Total Productive Maintenance)
• Equipment operation on semiconductor production lines