Engineer I - Failure Analysis

About the role

Microchip Technology is seeking an Engineer I in Failure Analysis to perform detailed electrical and physical investigations on its semiconductor products. The role involves using a range of non‑destructive and destructive analytical tools to identify root causes of product failures and communicate findings to internal teams and customers.

Key responsibilities

• Conduct electrical and physical failure analysis using X‑ray, Scanning Acoustic Microscope (SAM), optical microscopes, and bench verification tools.
• Interpret ATE data logs, circuit schematics, and apply fault isolation techniques such as Photo Emission Microscopy (PEM) and lock‑in thermography.
• Execute delidding and delayering processes including chemical and laser decapsulation, etching, polishing, and SEM/EDX analysis.
• Prepare comprehensive FA reports, provide regular updates, and define timelines for customers.
• Collaborate with cross‑functional teams including Quality, Reliability, Design, Test, and Wafer Fab to resolve failure cases.

Required profile

• Entry‑level engineering graduate with a strong interest in semiconductor failure analysis.
• Ability to work independently and as part of a multi‑disciplinary team.
• Effective communication skills for reporting technical findings.

Required skills

• X‑ray analysis
• Scanning Acoustic Microscope (SAM)
• Optical microscopy
• Electrical bench verification tools
• Automated Test Equipment (ATE) data interpretation
• Circuit schematic interpretation
• Photo Emission Microscope (PEM)
• Thermal emission / lock‑in thermography
• Optical Beam‑Induced Resistance Change (OBIRCH)
• Die‑level microprobing
• Chemical and laser decapsulation
• Chemical etch, dry etch, mechanical polishing
• Scanning Electron Microscope (SEM) and Energy Dispersive X‑ray (EDX) analysis

What we offer

• Opportunity to work on cutting‑edge semiconductor technology.
• Access to Microchip’s leadership development programs.
• Collaborative, diverse, and inclusive workplace culture.