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Senior Engineer, Reliability Engineering

Analog Devices · General Trias

New
Senior 🇬🇧 English
Python JMP MATLAB Oscilloscope Thermal sensors Failure analysis Six Sigma JEDEC

Job description

About the role

We are looking for a Senior Engineer specializing in Reliability Engineering to lead the definition and execution of reliability stress‑test plans for new semiconductor products, product revisions, and manufacturing changes. The role includes root‑cause analysis of qualification failures and driving corrective and preventive actions using structured problem‑solving methods.

Key responsibilities

  • Develop and execute qualification plans, reliability evaluations, and risk assessments.
  • Perform reliability statistical calculations such as MTTF, MTBF, Weibull, FIT and model failure rates.
  • Lead structured problem‑solving teams using Six Sigma, 8D, or similar methodologies.
  • Communicate qualification requirements across cross‑functional teams.
  • Identify and plan for application‑specific mission profiles.
  • Support internal and external customers with reliability inquiries.
  • Contribute to continuous improvement initiatives within the department.

Required profile

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field.
  • Minimum 5 years of experience in Reliability Engineering, Test/Product Engineering, or Failure Analysis within the semiconductor industry.
  • Familiarity with high‑reliability standards such as AEC‑Q100/Q101, JEDEC, MIL‑STD.
  • Strong foundation in electronics and semiconductor device physics.
  • Experience designing burn‑in boards, life‑test boards, and reliability test schematics.
  • Ability to debug and validate test hardware using bench instrumentation.
  • Proven expertise in failure analysis techniques and root‑cause investigation.

Required skills

  • Reliability statistical methods (MTTF, MTBF, Weibull, FIT)
  • Python, JMP, MATLAB for data analysis
  • Oscilloscope, Digital Multimeter (DMM), Source Measure Unit (SMU), thermal sensors
  • Burn‑in and life‑test board design
  • Failure analysis and electronic fault isolation
  • Six Sigma and 8D problem‑solving methodologies
  • Knowledge of standards AEC‑Q100, AEC‑Q101, JEDEC, MIL‑STD

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Published 2 hours ago

Expires 1 month from now

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Analog Devices

General Trias