Associate Engineer, Failure Analysis Engineering

About the role

Analog Devices (ADI) is hiring an Associate Engineer for its Global Failure Analysis organization, which supports internal and external customers in resolving product quality and reliability issues. The Associate Engineer studies reported failure modes on returned devices and engineering samples, determines failure mechanisms and provides technical evidence for root cause investigations. The role develops expertise in semiconductor devices, circuit analysis, electrical characterization and advanced failure analysis techniques.

Key responsibilities

• Perform failure analysis on customer returns, reliability failures, qualification failures and internal engineering requests.
• Verify and characterize electrical failures through bench testing, characterization and data analysis.
• Apply failure analysis techniques to confirm failure modes, identify mechanisms and support root cause investigations.
• Write clear, accurate failure analysis reports and communicate findings to quality, product, design and manufacturing teams and customers.
• Support product quality, reliability, manufacturing and design improvement activities.
• Contribute to continuous improvement, process enhancement and knowledge sharing.

Required profile

• Bachelor's degree in Electronics Engineering (ECE) or Electrical Engineering (EE).
• Good verbal and written communication skills in English.
• Ability to read and interpret circuit schematics and datasheets, and to turn them into bench-test setups.
• Fundamental understanding of semiconductor devices, analog and digital circuits, circuit analysis and electronic troubleshooting.
• Strong analytical, problem-solving and troubleshooting skills.
• Interest in circuit analysis, fault isolation and root cause investigation.

Required skills

• Familiarity with electronic test and measurement equipment such as oscilloscopes, power supplies, multimeters and function generators.
• Preferred: Python, LabVIEW or other engineering software; familiarity with semiconductor manufacturing, assembly or test processes; experience with data analysis, automation or scripting tools.
• Advantageous: exposure to microscopy, X-ray, SEM, FIB or fault isolation methods.