Assembly Process Engineer

About the role

The Assembly Process Engineer will design, monitor, and improve manufacturing processes to ensure safe, efficient, and cost‑effective production. This role focuses on semiconductor assembly steps such as wafer saw, die attach, and wirebond, driving continuous improvement across the fab.

Key responsibilities

• Process Optimization: Design and improve fabrication steps including Wafer Saw, Die Attach, and Wirebond.
• Data Analysis & Troubleshooting: Apply statistical tools to production data, identify root causes of defects, and resolve yield issues.
• Experimentation: Plan and execute Design of Experiments (DOE) to evaluate new materials, tools, or methods.
• Cross‑Functional Collaboration: Partner with equipment, quality, and design teams to launch new products and support smooth fab operations.
• Documentation: Write and update standard operating procedures, work instructions, and process specifications.

Required profile

• Education: Bachelor’s degree in Electronics Engineering, Industrial Engineering, Physics, or a related technical field.
• Technical knowledge: Familiarity with Statistical Process Control (SPC), cleanroom protocols, and root‑cause analysis tools.
• Soft skills: Strong cross‑functional communication and project‑management capabilities.

Required skills

• Statistical Process Control (SPC)
• Cleanroom protocols
• Root‑cause analysis tools
• Design of Experiments (DOE)
• Wafer Saw operation
• Die Attach processes
• Wirebond techniques